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- Magnetron sputtering of thin metal tapes;
- Contact and projection photolithography;
- Deep plasma chemical etching of silicon;
- Anodic bonding of glass and silicon wafers;
- Thinning of silicon wafers;
- Photoresist coating by spray method;
- Formation of micro-holes in glass by electroerosion;
- Separation of plates into Dicing;
- 3D assembly of sensors;
- Sealing of the housing:
- Control of the housing tightness;
- Setting up and calibrating gyroscopes, accelerometers, magnetometrs and pressure sensors;
